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Thermal Paste 2G Advanced Formula for CPU GPU IC & Heatsinks | Advanced Carbon
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Thermal Paste 2G Advanced Formula for CPU GPU IC & Heatsinks | Advanced Carbon
Price: US $16.99
Product description Easy to clean with included wipes

The 2g package of BS-155 comes with 1 big size cleaning wipes that have been pre-soaked in an isopropyl alcohol mixture, making the removal process a breeze. All you need to do is take one of the wipes and gently wipe away the thermal paste from both the CPU and the base of the cooler. It's that simple and you're all set!

Safety Application

Non-electrical conductive,non-volatile, flame retardant, which eliminates the risk of short circuit and discharges and corrosion damage to the chip and the radiator.

Excellent long-term stability

BS-155 unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 6 years or more.

Wide working temperature

Wide working temperature: -50℃ to 220℃ (-58℉ to 428℉).

Versatile range of applications

With its new composition, BS-155 is the suitable thermal compound for many application scenarios. Widely used for PC, Laptop, CPU, GPU, PS4, PS5, Coolers, IC, LED, Heatsink, etc.

Clean the surface of the CPU. Squeeze out an appropriate amount of thermal paste. Apply it as evenly as possible. Install the CPU cooler.
  • SAFE APPLICATION: Metal-free and non-conductive design eliminates the risk of short circuits while providing added protection for CPU and VGA cards.
  • BETTER THAN LIQUID METAL: Made with carbon microparticles, this thermal paste provides excellent thermal conductivity, helping transfer heat away from CPU/GPU quickly and efficiently.
  • HIGH DURABILITY: The upgraded thermal paste formula provides excellent heat dissipation performance and stable thermal management, helping systems maintain reliable performance under demanding workloads.
  • EXCELLENT PERFORMANCE: Compared with metal and silicon-based thermal conductive adhesives, BSFF thermal paste maintains consistent performance over time. Once properly applied, it provides reliable thermal transfer for long-term use.
  • EASY TO APPLY: Featuring an improved formula and ideal consistency, the thermal paste spreads smoothly and evenly. The included toolkit helps with precise application, making it simple for both beginners and experienced users.


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