Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities. Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer. It’s balanced viscosity and electrically insulated composition provides ultimate bonding with effortless application and clean up. The non-corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. CryoFuze has a versatile range of temperature performance, maintaining stability from -50°C up to 250°C.
High Performance: Utilizes nanoparticles for superior heat conductivity for your CPU or GPU.
Exceptional Thermal Conductivity: K value of 14W/mK handles even the most extreme system builds.
Anhygroscopic (non moisture absorbent): Electrically insulated and non-moisture absorbent properties to protect your CPU.
Easy Application: Viscously balanced formula allow for easy application and clean up.
Non Corrosive Formula: Non corrosive and oxidation resistant properties leave metal surfaces unharmed and does not solidify.