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Dynatron K2 LGA 1155/1156 Intel Core i3/i5/i7 Low Profile/1U CPU cooler, 73W TDP
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Dynatron K2 LGA 1155/1156 Intel Core i3/i5/i7 Low Profile/1U CPU cooler, 73W TDP
Price: US $47.95
Dynatron K2 Low-Profile/1U CPU Cooler for Intel LGA 1155/1156


Dynatron K2 LGA 1155/1156 Intel Core i3/i5/i7 Low Profile CPU Cooler

Dynatron K2 low-profile CPU cooler for Intel LGA 1155 and 1156 applications, including: 2nd generation Intel Core i3/i5/i7, 3rd generation Intel Core i3/i5/i7 and Intel Xeon E3 processors. Maximum TDP 73W design w/ pre-printed thermal compound. The K2 features a copper heatsink w/ alloy-frame PWM, double ball-bearing blower for compact and efficient cooling.

Notable features:

  • Supports LGA 1155 and LGA 1156 CPUs with 73W TDP Max.
  • Copper Heatsink w/ pre-printed thermal compound
  • 75mm Alloy-frame PWM, double ball-bearing blower
  • Easy-to-install push-pin design
Dynatron K2 LGA 1155/1156 Intel Core i3/i5/i7 Low Profile CPU Cooler Model Number K2 Compatibility LGA 1155, LGA 1156
2nd Generation Intel Core i3/i5/i7 Processors
3rd Generation Intel Core i3/i5/i7 Processors
Intel Xeon E3
Maximum TDP: 73W Overall Dimensions 282.6 x 81 x 27.8mm Weight 380g Heatsink Copper w/ skived fins Rated Voltage 12V Speed At Duty Cycle 20%: 1000 RPM
At Duty Cycle 50%: 2500 RPM
At Duty Cycle 100%: 4000 RPM Air Flow At Duty Cycle 20%: 6.0 CFM
At Duty Cycle 50%: 8.3 CFM
At Duty Cycle 100%: 11.9 CFM Noise Level At Duty Cycle 20%: 21.0 dBA
At Duty Cycle 50%: 37.8 dBA
At Duty Cycle 100%: 44.0 dBA Air Pressure At Duty Cycle 20%: 0.087 inch-H2O
At Duty Cycle 50%: 0.453 inch-H2O
At Duty Cycle 100%: 0.929 inch-H2O Pre-applied Thermal Compound GE-Toshiba TIG830SP Installation Push-pin Mounting International Shipping Details
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