Recommend for Intel® Socket LGA 1150, LGA 1151, LGA 1155,LGA 1156, and LGA 1200, Aluminum 75 x 75 x 15 mm PWM Blower with CopperHeatsink, Push-pin Mounting Type, Active Cooler for Mini-ITX Form Factor,Support 125 Watts CPU Power Heat Dissipation.

Model Number: K2

• Recommend for Intel® CPU as following

Intel® Xeon® Processor E3 v4 Family, SocketFCLGA 1150
Intel® Xeon® E Processor/Intel Core™ i7 Processor, Socket FCLGA 1151
Intel® Xeon® Processor E3 Family/Intel Core™ i5 Processor, Socket LGA 1155
Intel® Xeon® processor X3400, Socket LGA 1156
Intel® Core™ i3/i5/i7 Processor, Socket FCLGA 1200

• Active Cooler for Mini-ITX Form Factor and Quiet Solution

Overall Specification

Dimension: 82.6 x 81.0 x 27.8 mm
Weight: 380g ± 5g
Material: Copper Heat Sink with Skiving Fins
Fan: Alloy Frame Blower with PWM function
Mounting: Method Plastic Push-Pin Mounting for avoiding interference with backend components
Thermal Grease: GE-Toshiba TIG830SP Thermal Grease Pre-Printed
TDP: Support 125 Watts CPU Power Heat Dissipation

Blower Specification

Model Number: DB127515BM-A
Dimension: Ø75.0 x 15.0 mm
Bearing: Double-Ball
Rated: Voltage 12VRated Speed
At Duty Cycle 0~20%: 1000 ± 10 RPM
At Duty Cycle 50%: 2500 ± 10% RPM
At Duty Cycle 100%: 4000 RPM Max

Power Consumed
At Duty Cycle 0~20%: 0.60 W
At Duty Cycle 50%: 1.80 W
At Duty Cycle 100%: 4.80 W

Maximum Airflow
At Duty Cycle 0~20%: 6.0 CFM
At Duty Cycle 50%: 8.3 CFM
At Duty Cycle 100%: 11.9 CFM

Rated Static Pressure
At Duty Cycle 0~20%: 2.2 mm- H2O
At Duty Cycle 50%: 11.5 mm-H2O
At Duty Cycle 100%: 23.6 mm-H2O

Acoustical Noise
At Duty Cycle 0~20%: 21.0 dBA
At Duty Cycle 50%: 37.8 dBA
At Duty Cycle 100%: 44.0 dBA