High-Density Silver Thermal Compound
Pack of 5 - 3.5g Each
Product Highlights:
- Made with 99.9% pure silver for unparalleled thermal conductivity.
- High-Density composition for maximum particle contact area.
- Controlled triple-phase viscosity for optimal thermal transfer.
- Non-electrically conductive for peace of mind during application.
- Absolute stability ensures longevity and reliable performance.
Advanced Thermal Performance
5 is engineered specifically for high-performance applications, designed to significantly reduce CPU core temperatures by up to 50°F compared to standard silicone thermal pastes. Each 3.5g tube can effectively cover up to 25 CPU cores, making it a perfect choice for enthusiasts and professionals alike.
Innovative Composition
- Contains three unique shapes and sizes of micronized silver particles to ensure maximum thermal transfer.
- Incorporates thermally-enhanced ceramic particles such as sub-micron zinc oxide, aluminum oxide, and boron nitride for superior performance and stability.
Controlled Triple-Phase Viscosity Explained
This advanced thermal compound does not utilize silicone, relying instead on a proprietary mixture of polysynthetic oils. Its tri-phase functionality provides an effortless application that enhances its effectiveness:
- Initial Phase: Thins out to fill microscopic valleys for optimal contact.
- Intermediate Phase: Adjusts within 50 to 200 hours to achieve final consistency.
- Final Phase: Thickens slightly for long-term stability and reliability.
Why Choose 5?
Transform your thermal management approach with 5. Its high-density formulation, coupled with silver components, delivers unrivaled thermal performance and longevity. Choose 5 for peace of mind as you push your systems to their limits.
Take your cooling solutions to new heights – order your pack of 5 today!
Unit Quantity: 3.5Material: Aluminum Oxide,Boron Nitride,Silver,Zinc OxideTo Fit: CPU,HeatsinkType: Thermal CompoundColor: GrayPower Connection: NonePackaging: SyringeUnit Type: g
