Model: OC-TD-01Material: AluminumColor: SilverSize:198mm*74mm*14mm (without water nozzle) Interface: Outer diameter 10.5mmProcess: One-piece aluminum weldingNet weight: 300gApplication: Semiconductor chip heat dissipationFeatures:The water cooled plate is made of all aluminum and welded in one. It is used for the heat dissipation of semiconductor chips. Nozzle fixed in one, reduce the possibility of liquid leakage in the process of use, prolong the service life.Note to buyers:In order to make better use of the water cold plate, please confirm the position of the screw hole before ordering.To get better thermal conductivity,there is no special treatment on surface,it is normally caused please don’t worry there is no influence to water cooling system.
OCOCOO Water Cooled Plate Semiconductor Aluminum Heat Sink Overall Welding DIYProduct parameters:Model: OC-TD-01
Material: Aluminum
Color: Silver
Size:198mm*74mm*14mm (without water nozzle)
Interface: Outer diameter 10.5mm
Process: One-piece aluminum welding
Net weight: 300g
Application: Semiconductor chip heat dissipation
Features:
The water cooled plate is made of all aluminum and welded in one. It is used for the heat dissipation of semiconductor chips. Nozzle fixed in one, reduce the possibility of liquid leakage in the process of use, prolong the service life.
Note to buyers:
In order to make better use of the water cold plate, please confirm the position of the screw hole before ordering.
To get better thermal conductivity,there is no special treatment on surface,it is normally causedplease don’t worry there is no influence to water cooling system.
Attention to buyer:
The after-sales guarantee period for the product is seven days. If there are any problems or questions, please contact us. Timed out will cancel this service.
