Hydronaut Pro is a silicone-free thermal paste with an optimized formulation that is suitable for use in both industrial systems and high-performance PC systems. Thanks to its outstanding thermal conductivity, it is particularly well suited for applications with large-surface heat sinks, such as gaming PCs with custom water cooling. Hydronaut Pro combines high performance with an attractive price-performance ratio and is also designed for overclocking applications. Properties Suitable for industrial applications Outstanding thermal conductivity Silicone-free Electrically non-conductive No hardening over time Available in three sizes: 2g | 6g | 30g Silicone-Free for Industrial Systems Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, silicone-based oils (e.g., siloxanes) are used as the carrier fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect. In normal PC use, this is generally uncritical. In industrial applications, however, leaking silicone-based oil may be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties.